LG Electronics is now preparing for the launch of their upcoming premium smartphone called, LG G7 ThinQ. Recently, we have seen a promo image of the device, and today, the smartphone got leaked in its entirely from the same leakster on Twitter. The device looks absolutely stunning in a new design which also features a dedicated Google Assistant button on-board.
The new leaked official render image of the device looks stunning. The leaked image shows off the device from all the sides. The phone is scheduled to launch on May 2nd in New York city and on May 3rd, the device would be launched in Seoul.
The latest leak reveals the entire hardware specifications of the device. According to new render, the phone carries a fullView display with a notch at the top. The device also features a 3.5mm AudioJack on-board which lets you connect various compatible headphones and other devices.
The tipster, Evan Blass has released its high-quality render today. The image surfaced online and made headlines already with its elegant design. The device to sport an edge-to-edge display just like other premium smartphones of its range. Small bezels at the bottom side makes the device look even more handy.
On the cameras, the device comes with a dual cameras at the back panel. The cameras are placed vertically. It also features an LED flash with Laser Autofocus. There is a physical Fingerprint Scanner also available at the back panel underneath the camera sensors.
At the middle of its back side, the company has placed the LG ThinQ logo. At the bottom, the company’s own logo, LG can be clearly seen.
On the sides, at the right side there is a Power Key or Lock Key available. At the left side, we could see Volume Rocker button along with a dedicated Google Assistant button just like Samsung’s Bixby button. Reports suggest that the phone would be featuring a Dedicated Voice Assistant button just like the Bixby button on Samsung’s smartphones. There is no any official words on the availability of such dedicated virtual assistant available.
At the bottom side, the phone would come with a 3.5mm AudioJack. On the connectivity front, there will be a USB Type-C port also available. At the bottom side, there will be antenna and speaker grille present. The SIM tray would be placed at the top.
According to previous leaks, the LG G7 ThinQ smartphone is expected to be powered by Qualcomm’s Snapdragon 845 Chipset. There will be an M+ LCD display available on-board. At the back, the device would be featuring 16 Megapixel of camera sensors.